Short-pulse UV laser ablation of solid and liquid metals: indium

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Short-pulse UV laser ablation of solid and liquid metals: indium

Laser-ablation experiments on solid (T = 300 K) and liquid (T = 600 K) indium are reported. The ablation was performed under high vacuum conditions with UV laser pulses at 248 nm and pulse durations of 15 ns and 0.5 ps. The ablated neutral indium atoms were resonantly ionized with a second laser pulse 28 mm above the sample surface and detected in a time-of-flight mass spectrometer. The ablatio...

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Sub-picosecond UV laser ablation of metals

Laser ablation of Nickel, Copper, Molybdenum, Indium, Tungsten and Gold by short ultraviolet laser pulses (0.5 ps, 248 nm) in vacuum is reported for the first time. For Nickel and Indium, ablation is also studied in air to demonstrate the influence of the ambient atmosphere. Metal ablation in air is significantly less efficient than in vacuum due to redeposition of ablated material. The ablatio...

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Atomistic Modeling of Short Pulse Laser Ablation of Metals: Connections between Melting, Spallation, and Phase Explosion†

The mechanisms of short pulse laser interactions with a metal target are investigated in simulations performed with a model combining the molecular dynamics method with a continuum description of laser excitation, electron-phonon equilibration, and electron heat conduction. Three regimes of material response to laser irradiation are identified in simulations performed with a 1 ps laser pulse, w...

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Mechanisms of nanoparticle formation by ultra-short laser ablation of metals in liquid environment.

Laser ablation in liquids is now commonly used to produce colloidal nanoparticles (NPs) that have found numerous applications in different areas. In experiments, NPs of different materials can be rather easily obtained by using laser systems with various pulse durations, shapes, wavelengths, and fluences. In this paper, we focus our attention on metal (gold) NPs produced by ultra-short laser pu...

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Laser Ablation of Metals

Laser ablation is the process of removing material with very intensive, pulsed laser radiation. It is a technology which gains increasingly greater importance for drilling, eroding, welding, structuring and marking of all kinds of materials. With the advent of ultrashort picoand femtosecond pulses especially, a large number of new processing methods were developed. A deeper understanding of the...

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ژورنال

عنوان ژورنال: Applied Physics A: Materials Science & Processing

سال: 1997

ISSN: 0947-8396,1432-0630

DOI: 10.1007/s003390050513